【Information】 Idemitsu Unitech Co., Ltd. & Plaloc Asia (Thailand) Co., Ltd. will exhibit at PACK EXPO International 2024

Schedule Nov 3-6, 2024
Placement McCormick Place
Exhibitor Idemitsu Unitech Co., Ltd.
Booth No. S-4386

Idemitsu Unitech and Plaloc Asia will exhibit at PACK EXPO International 2024, McCormick Place in Chicago, November 3 – 6.

The booth will exhibit innovative & sustainable Zipper products, and latest developments of packaging materials.

Idemitsu Unitech is showcasing solutions in the following categories:
(1) Sustainability: Sustainable Zipper (Recyclable, Compostable and Bio-based)
(2) Usability: POCKETZIP™ (Front panel zipper pouch with pull tab), Linear Tear Zipper and Film
(3) Functionality: Microwavable Zipper, Child-resistant Zipper, Retortable PP Film

Visit Idemitsu Unitech & Plaloc Asia at PACK EXPO International 2024, booth S-4386!

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