TOUGHZET™

タフゼット™イメージ

TOUGHZET™ is a "special polycarbonate resin" created using Idemitsu Kosan's polymerization technology.
Our polymer design technology allows us to custom design according to customer needs, and it is also possible to impart multiple properties. Currently, it is used as a resin for coating the surface of electrophotographic photoconductor (OPC) drums in laser printers and copiers. Please feel free to contact us regarding specific functional designs.

solvent soluble

Soluble in general purpose organic solvents (THF, toluene, cyclohexanone, etc.).
Forms a transparent film without crystallization even after application.

溶剤可溶性表
General-purpose PC

General-purpose PC

TOUGHZET™

TOUGHZET™

Solubility in THF

General-purpose PC

General-purpose PC

TOUGHZET™

TOUGHZET™

solution cast film

Low dielectric properties

It has low dielectric properties comparable to epoxy resins and polyimide resins.
We are currently developing materials with the aim of lower dielectric constant and lower dielectric loss tangent.

低誘電特性表

High heat resistance

It is possible to maintain higher heat resistance than general-purpose PC (Tg: 150-270℃).

Glass transition temperature of various PCs

Glass transition temperature of various PCs

elastic modulus control

It is possible to control the elastic modulus.

Elastic modulus of TOUGHZET™

Elastic modulus of TOUGHZET™

high hardness

It is also possible to make it harder than general-purpose PC.

Vickers hardness of various PCs

Vickers hardness of various PCs

Adds water and oil repellency

It is possible to provide water repellency, oil repellency, and surface lubricity compared to general-purpose PC.

撥水・撥油性付与表

Other properties: flexibility, refractive index control, hardenability

Flexibility control:

By introducing soft segments, it is possible to impart flexibility (extensibility) similar to that of thermoplastic elastomers.

Refractive index control:

It is possible to impart optical properties different from normal ones.

Refractive index and Abbe number of TOUGHZET™

refractive index 1.54~1.64
Abbe number 24~36

Adding hardenability:

By introducing various crosslinking components into special PC, which is a thermoplastic resin, we aim to further improve its physical properties and apply it to thermosetting (photocuring) processes.

Application example

  • Various binder resins (electrophotographic photoreceptors, inks/paints, conductive pastes, etc.)

  • High-frequency insulation materials for electronic boards (multilayer boards/antennas, etc.) and semiconductor boards

  • Optical lenses/optical parts

  • optical waveguide

  • coating material

  • glue

  • Resin modification material

  • The data and descriptions in this document are for reference when designing products that use TOUGHZET™.
    The contents of this document are based on tests and information believed to be reliable, but the data and statements should not be considered definitive.
    When applying this to individual products, please be sure to separately confirm the appropriateness of the design.

  • The uses described in this document do not guarantee the results of applying this product to those uses.

Inquiry flow

Inquiry flow
  • When making an inquiry, please select "Petrochemical" as the inquiry category.