TOUGHZET™

TOUGHZET™ is a "special polycarbonate resin" created using Idemitsu Kosan's polymerization technology.
Our polymer design technology allows us to custom design according to customer needs, and it is also possible to impart multiple properties. Currently, it is used as a resin for coating the surface of electrophotographic photoconductor (OPC) drums in laser printers and copiers. Please feel free to contact us regarding specific functional designs.
solvent soluble
Soluble in general purpose organic solvents (THF, toluene, cyclohexanone, etc.).
Forms a transparent film without crystallization even after application.


General-purpose PC

TOUGHZET™
Solubility in THF

General-purpose PC

TOUGHZET™
solution cast film
Low dielectric properties
It has low dielectric properties comparable to epoxy resins and polyimide resins.
We are currently developing materials with the aim of lower dielectric constant and lower dielectric loss tangent.

High heat resistance
It is possible to maintain higher heat resistance than general-purpose PC (Tg: 150-270℃).

Glass transition temperature of various PCs
elastic modulus control
It is possible to control the elastic modulus.

Elastic modulus of TOUGHZET™
high hardness
It is also possible to make it harder than general-purpose PC.

Vickers hardness of various PCs
Adds water and oil repellency
It is possible to provide water repellency, oil repellency, and surface lubricity compared to general-purpose PC.

Other properties: flexibility, refractive index control, hardenability
Flexibility control:
By introducing soft segments, it is possible to impart flexibility (extensibility) similar to that of thermoplastic elastomers.
Refractive index control:
It is possible to impart optical properties different from normal ones.
Refractive index and Abbe number of TOUGHZET™
refractive index | 1.54~1.64 |
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Abbe number | 24~36 |
Adding hardenability:
By introducing various crosslinking components into special PC, which is a thermoplastic resin, we aim to further improve its physical properties and apply it to thermosetting (photocuring) processes.
Application example
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Various binder resins (electrophotographic photoreceptors, inks/paints, conductive pastes, etc.)
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High-frequency insulation materials for electronic boards (multilayer boards/antennas, etc.) and semiconductor boards
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Optical lenses/optical parts
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optical waveguide
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coating material
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glue
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Resin modification material
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The data and descriptions in this document are for reference when designing products that use TOUGHZET™.
The contents of this document are based on tests and information believed to be reliable, but the data and statements should not be considered definitive.
When applying this to individual products, please be sure to separately confirm the appropriateness of the design. -
The uses described in this document do not guarantee the results of applying this product to those uses.
Inquiry flow

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When making an inquiry, please select "Petrochemical" as the inquiry category.