TOUGHZET™
TOUGHZET™ is a "special polycarbonate resin" created by Idemitsu Kosan's polymerization technology.
Using polymer design technology, we can create custom designs according to customer requests and even add multiple properties. Currently, it is used as a coating resin for the surface of electrophotographic photoconductor (OPC) drums in laser printers and copiers. Please feel free to contact us regarding specific functional designs.
solvent soluble
Soluble in general purpose organic solvents (THF, toluene, cyclohexanone, etc.).
Forms a transparent film without crystallization even after application.
General-purpose PC
TOUGHZET™
Solubility in THF
General-purpose PC
General-purpose PC
solution cast film
Low dielectric properties
It has low dielectric properties comparable to epoxy resins and polyimide resins.
We are currently developing materials with the aim of lower dielectric constant and lower dielectric loss tangent.
High heat resistance
It is possible to maintain higher heat resistance than general-purpose PC (Tg: 150-270℃).
Glass transition temperature of various PCs
elastic modulus control
It is possible to control the elastic modulus.
TOUGHZET™ elastic modulus
high hardness
It is also possible to make it harder than general-purpose PC.
Vickers hardness of various PCs
Adds water and oil repellency
It is possible to provide water repellency, oil repellency, and surface lubricity compared to general-purpose PC.
Other properties: flexibility, refractive index control, hardenability
Flexibility control:
By introducing soft segments, it is possible to impart flexibility (extensibility) similar to that of thermoplastic elastomers.
Refractive index control:
It is possible to impart optical properties different from normal ones.
TOUGHZET™ refractive index and Abbe number
| refractive index | 1.54～1.64 |
|---|---|
| Abbe number | 24～36 |
Adding hardenability:
By introducing various crosslinking components into special PC, which is a thermoplastic resin, we aim to further improve its physical properties and apply it to thermosetting (photocuring) processes.
Application example
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Various binder resins (electrophotographic photoreceptors, inks/paints, conductive pastes, etc.)
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High-frequency insulation materials for electronic boards (multilayer boards/antennas, etc.) and semiconductor boards
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Optical lenses/optical parts
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optical waveguide
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coating material
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glue
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Resin modification material
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The data and descriptions published in this document are for reference when designing products using TOUGHZET™.
Although the information contained herein is based on reliable testing and information, the data and statements should not be considered absolute.
When applying to individual products, be sure to separately confirm the validity of the design. -
The uses described in this document do not guarantee the results of applying this product to those uses.
Inquiry flow
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When making an inquiry, please select "Petrochemical" as the inquiry category.